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Electrical semiconductor characterization
Luminescence dating, research, dosimetry and more
Contamination monitor, beta-aerosol monitor, dose rate meter and more
Mono- and Multi-crystalline wafer lifetime measurement device
State of the art system for topographic electrical characterization of multicrystalline bricks in fabs with high throughput....
Production integrated high speed wafer mapping of carrier lifetime. Single wafer topograms in less than one second a wafer.
Low cost table top lifetime measurement system for characterization of a variety of different silicon samples at different...
Mono- and Multi-crystalline wafer and brick lifetime measurement device
Flexible OEM unit for lifetime measurements at a variety of different samples ranging from mono- to multicrystalline silicon...
Microwave Detected Photo Induced Current Transient Spectroscopy
The minority carrier life time is sensitive for all kinds of electrically active defects in semiconductors and is therefore...
MDP is an advanced technology with a so far unsurpassed combination of sensitivity, speed and resolution for fab and lab...
for quality control of bifacial PERC/PERC+ solar cells and more
portable in field PID tester for solar modules
user friendly and advanced operating software
The PIDcon devices are designed to investigate the PID susceptibility for production monitoring of solar cells as well as tests...
Learn more about the reasons for PID and the how the susceptibility of solar cells, mini modules and encapsulation materials can...
For ultra-fast crystal orientation and rocking curve measurements
Flexible diffractometer for ultra-fast Omega Scan orientation determination
Smart diffractometer for ultra-fast Omega-scan of small samples.
Robust XRD equipment for fully automated in-line testing & alignment
for blanks, wafers & bars (AT, SC, TF, etc.)
three generations of X-ray engineers
in industrial production, R&D and more
discover the most convenient way of measuring orientation of single crystals
Our quality management system is an integrated process-oriented system with ISO 9001 certification.
State of the art system for topographic electrical characterization of multicrystalline bricks in fabs with high throughput. Total measurement times of less than one minute at 1 mm resolution for one face of the brick. Bricks are automatically turned around to facilitate measurements of all 4 sides of each brick.
MDPinline ingot systems are worldwide the fastest measurement tools available for electrical characterization of multicrystalline silicon bricks. They are designed for single brick investigation in high throughput production fabs. Every brick can be measured on four sides in less than one minute per face. All maps (lifetime, photoconductivity, resistivity) are measured simultaneously.
The system includes a database and statistical data evaluation, which can be used for automated determination of precise cut positions for yield improvement, for material quality monitoring, for furnace selection and process improvement.
contactless destruction free electrical semiconductor characterization
mapping capability of minority carrier lifetime
advanced sensitivity for visualization of so far invisible defects
automated cut criteria definition
steady state measurements for extraction of bulk properties
completely automated for inline integration
2-dimensional brick mapping system for solar grade silicon, one millimetre resolution, measurement time: one face of a brick in less than 1 minutes, automated measurement of all 4 faces
World record speed for inline multicrystalline silicon brick characterization for advanced PV fabs. Measurement of carrier lifetime with one millimeter resolution in less than one minute for one face of a brick. Spatial resolved measurement of conduction type changes as well as resistivity maps are measured at the same time.
Customer defined brick cut criteria can be transmitted to the fab database, which allows a fully automated material monitoring for next generation photovoltaic fabs. Enables material quality control and monitoring of furnace performance, and failure analysis.
Special “underneath the surface” measurement technique reduces distortion of data by surface recombination considerably.
ingot maps and linescans
resistivity map with 1 cm² resolution
p/n equivalent map with 1 mm² resolution
iron mapping capability